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Almit MR-NH Krem Lehim Numune Talep Formu

Small area ratio, big performance

The constantly increasing miniaturization poses completely new challenges for industrial production. In order to meet these at eye level, we are developing new generations of soldering and fluxing agents in our Almit research centres. MR-NH is an innovative high-performance solder paste with an outstanding performance that opens up new dimensions in SMT production and stencil printing. Even in applications with an area ratio of less than 0.6, MR-NH convinces with perfect release properties, so that a step stencil is not required for a high component mix.

Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de!

Short facts

almit_a Area ratio < 0.6
almit_a Powder size 20-38 µm and 10-28 µm
almit_a ROL0 halogen-free

Special advantages

almit_a Excellent print image
almit_a Excellent release properties
almit_a Optimal contour stability
almit_a Applicable with almost all stencils

Solder paste printing - area ratio

  • PC 7525B Stencil Design Guidelines recommends an area ratio greater than 0.66 for sufficiently good release of the solder paste from the stencil.
  • The area ratio takes into account the stencil thickness and the opening area.
  • For very small components, correspondingly small openings (=apertures) become necessary, the area ratio becomes significantly smaller than 0.66, which can lead to solder paste printing problems.
  • For this reason, Almit has developed the MR-NH solder paste in order to achieve good release behavior even at an area ratio of significantly less than 0.6.

Examples for Area Ratio with stencil thickness 120/100/80 µm for components:
almit_a BGA pitch 0,5 mm
almit_a BGA pitch 0,4 mm
almit_a BGA pitch 0,3 mm
almit_a CHIP 0201 (non metric, 0,6 mm x 0,3 mm)
almit_a CHIP 01005 (non metric, 0,4 mm x 0,2 mm)

ComponentStencil thickness in µm 120
 Pad Dmr. in mmArea ratio EU
BGA pitch 0,5 mm0,280,58
BGA pitch 0,4 mm0,220,46
BGA pitch 0,3 mm0,180,38
 Pad L x W in mm
Chip 0201
non metric
0,280,54
0,24
Chip 01005
non metric
0,180,36
0,17
ComponentStencil thickness in µm 100
 Pad Dmr. in mmArea ratio EU
BGA pitch 0,5 mm0,280,70
BGA pitch 0,4 mm0,220,55
BGA pitch 0,3 mm0,180,45
 Pad L x W in mm
Chip 0201
non metric
0,280,65
0,24
Chip 01005
non metric
0,180,44
0,17
ComponentStencil thickness in µm 80
 Pad Dmr. in mmArea ratio EU
BGA pitch 0,5 mm0,280,88
BGA pitch 0,4 mm0,220,69
BGA pitch 0,3 mm0,180,56
 Pad L x W in mm
Chip 0201
non metric
0,280,81
0,24
Chip 01005
non metric
0,180,55

 

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